ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Moisture . IPC/JEDEC J-STD-020D.1 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices A joint standard developed by the IPC Plastic Chip .
Supersedes IPC/JEDEC J-STD-020D August 2007 JOINT INDUSTRY . JOINT INDUSTRY STANDARD Moisture/Reow .. Mount Devices IPC/JEDEC J-STD-020D.1 March 2008 Supersedes IPC/JEDEC J-STD-020D August 2007.. .. 12 ANNEX B Major .
J-STD-020E Soldering Reliability Engineering IPC/JEDEC J-STD-020D August 2007 .. 12 v IPC/JEDEC J-STD-020E January 2015 ANNEX A .. J-STD-609A-01.. J-STD-609B.. Ipc Jedec9704a.
Moisture/Reflow Sensitivity Classification for Nonhermetic . Sensitivity Classification for Nonhermetic Surface .. IPC/JEDEC J-STD-020D.1 - .
JEDEC J-STD-020E - Techstreet JEDEC J-STD-020E JOINT IPC .. standard by JEDEC Solid State Technology Association, 12/01/2014.. View all product details .. JEDEC J-STD-020D.01.
Product Summary A Features and Benefits Product Summary TA = +25C .. Level 1 per J-STD-020D Terminals: Solderable per MIL-STD-202, Method 208 .. 0.01 0.1 1 0.001 0.0001
jstd020d-01 Electrostatic Discharge Soldering - Scribd jstd020d-01 - Download as PDF File .. IPC/JEDEC J-STD-020D.. 1 .. PASS Classification for Level Tested NO FAIL Classification for Level Tested IPC-J-STD-020d-a 12 .
Table 2 Reflow Profiles (per Jedec J-STD-020D.1) Table 2 Reflow Profiles (per Jedec J-STD-020D.1) Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat/Soak Temperature Min (Tsmin) 100 C 150 C
IPC J-STD-020E - Techstreet IPC J-STD-020E Moisture .. 01/01/2015.. View all product .. IPC J-STD-020D-1.. March 2008 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State .